发明名称 METHOD FOR USING SPUTTERING TARGET AND METHOD FOR MANUFACTURING OXIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for using a sputtering target which enables an oxide film with a high degree of crystallinity, the oxide film containing a plurality of metal elements, to be formed.SOLUTION: This invention provides a method for using a sputtering target including a polycrystalline oxide containing a plurality of crystal grains. The crystal grains includes a cleavage plane. An ion is made to collide with the sputtering target, to separate sputtered particles from each cleavage plane. The sputtered particles are positively charged, so that the sputtered particles are deposited uniformly on a deposition surface while repelling each other.
申请公布号 JP2014133942(A) 申请公布日期 2014.07.24
申请号 JP20130134516 申请日期 2013.06.27
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 C23C14/08;H01L21/336;H01L21/363;H01L21/8242;H01L21/8244;H01L27/10;H01L27/108;H01L27/11;H01L29/786;H01L51/50;H05B33/08;H05B33/10;H05B33/14 主分类号 C23C14/08
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