LIGHT EMITTING DEVICE

摘要

An embodiment of the present invention relates to a light emitting device, a manufacturing method thereof, a light emitting device package and a lighting system. The light emitting device according to the embodiment of the present invention includes a bottom electrode layer (148); a reflecting layer (144) which is formed on the bottom electrode layer (148); a second conductive semiconductor layer (116) which includes a current spreading layer therein and is formed on the reflecting layer (144); an active layer (114) which is formed on the second conductive semiconductor layer (116); and a first conductive semiconductor layer (112) which is formed on the active layer (114).