| 主权项 |
1. A chip package, comprising:
a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer disposed on the second surface of the substrate, wherein the protection layer has an opening; a conducting bump disposed on the second surface of the substrate and filled in the opening; a conducting layer disposed at a first side of the protection layer between the protection layer and the second surface of the substrate, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump; and a light shielding layer disposed on a second side of the protection layer opposite the conducting layer, wherein the light shield layer is separated from the conducting bump to define a gap between the conducting bump and the light shielding layer and surrounding the opening in the protection layer, wherein the gap is not filled with an electrically conductive material, and wherein the light shielding layer does not contact with the conducting bump and does not extend to cover any sidewall between the first and second sides of the light shield layer. |
