| 摘要 |
<p>Disclosed is a light emitting diode package module. Since a light emitting package module is located under a printed circuit board or on the same plane as the printed circuit board, heat is efficiently radiated from a light emitting diode package through a radiation plate so that heat properties of a lighting product with the light emitting diode package installed therein may be improved. Further, a design cost of the lighting product with the light emitting diode package installed therein may be reduced by applying a slimmed and flexible design. The light emitting diode package module includes a radiation plate (100) with a plurality of radiation fins (110); a printed circuit board (200) disposed at an upper side of the radiation plate (100) and having a plurality of holes (210); and a light emitting diode package (300) disposed inside the hole (210) formed in the printed circuit board (200) and electrically connected to the printed circuit board (200), and directly making contact with the radiation plate (100).</p> |
