Buried Hard Mask for Embedded Semiconductor Device Patterning

摘要

Methods and apparatus for manufacturing semiconductor devices, and such semiconductor devices, are described. According to various aspects of the disclosure, a semiconductor device can be manufactured by forming a core region of the semiconductor device and forming a periphery region of the semiconductor device. A first polysilicon region can then be formed over the core and periphery regions of the semiconductor device. A first mask is formed on the first poly silicon layer and a second polysilicon layer is disposed such that the second polysilicon layer covers the first mask. A second mask can then be formed on the second polysilicon layer. After forming the second mask, portions of the first and second polysilicon layers that are uncovered by either the first or second masks are removed.

主权项

1. A method of manufacturing an embedded semiconductor device, comprising:
forming a core region of the semiconductor device; forming a periphery region of the semiconductor device; disposing a first polysilicon layer over the core and periphery regions of the semiconductor device; forming a first mask on the first polysilicon layer; disposing a second polysilicon layer such that the second polysilicon layer covers the first mask; forming a second mask on the second polysilicon layer; and removing portions of the first and second polysilicon layers that are uncovered by either of the first and second masks.