| 摘要 |
FIELD: heating.SUBSTANCE: assembled mould with a heating device, which is used in thermoplastic or thermoreactive processes, includes an upper mould with upper contact surface, a lower mould, two current-carrying plates and two wires. The lower mould includes a conductive layer, a lower contact surface formed on the conducting layer and facing to the upper contact surface, an insulating surface formed on the conducting layer and facing to the opposite side relative to the lower contact surface, and an insulating layer formed on the insulating surface. Two conducting plates are located on the conducting layer of the lower mould. Two wires are connected to conducting plates and each of them has resistance that is less than that of the conducting layer. The insulating surface of the lower mould is bigger than the lower contact surface.EFFECT: according to the invention, the assembled mould has low cost and provides more uniform temperature distribution along the mould surface.7 cl, 11 dwg |
