INSULATING MATERIAL, INSULATING LAYER COMPOSITION COMPRISING THE SAME, AND SUBSTRATE USING SAID INSULATING LAYER COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide an insulating material with a new structure, which has advantage in insulation, rigidity, and heat resistance, and an insulating layer composition comprising the same, and a substrate using the insulating layer composition.SOLUTION: The insulating material includes a structure in which polysilsesquioxane (POSS) is combined with a main chain of a soluble liquid crystal thermosetting oligomer. The soluble liquid crystal thermosetting oligomer is a soluble liquid crystal thermosetting polymer with a low coefficient of thermal expansion used in an insulating layer of a printed circuit board.