发明名称 Light emitting device package and fabrication method thereof
摘要 A light emitting device package and a manufacturing method thereof are provided to reduce the light loss by isolating the light emitting device from the package body. A light emitting device package(100) comprises a package body(110), a space member(131), and a light emitting device(120). The package body has a plurality of electrodes(113,115). The package body includes at least one space member. The space member includes at least one light emitting device. The manufacturing method of the light emitting device package comprises a step for forming the groove(111); a step for forming a plurality of electrodes; a step for forming the space member; a step for forming the light emitting device. The groove is formed on the upper side of the package body.
申请公布号 KR101417003(B1) 申请公布日期 2014.07.09
申请号 KR20070087903 申请日期 2007.08.30
申请人 发明人
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
主权项
地址