| 摘要 |
The present invention provides a copper-clad laminate made by laminating a copper thin film on at least one surface of a resin-impregnated sheet made by impregnating liquid crystal polyester on a fiber sheet, wherein the 10-point average roughness (Rz) of a surface of the copper thin film in contact with the resin-impregnated sheet is 1.0-5.0μm. The copper-clad laminate has excellent adhesiveness between the copper thin film and the resin-impregnated sheet and excellent etching processability of the copper thin film. |
