| 摘要 |
With regard to an epoxy resin composition for encapsulating a semiconductor device which comprises epoxy resin, a hardener, an inorganic filler, and a coloring agent, the present invention relates to an epoxy resin composition for encapsulating a semiconductor device, which includes modified copper hydroxide phosphate as the coloring agent, and to a semiconductor device encapsulated using the epoxy resin composition. |
