| 摘要 |
PROBLEM TO BE SOLVED: To provide a tip feed type liquid resin composition for semiconductor sealing capable of solder-connecting the wiring of a substrate and the solder bump of a semiconductor chip while eliminating voids between the semiconductor chip and the substrate in a short time, and having no generation of delamination after curing.SOLUTION: Provided is a prior supply type liquid resin composition 41 for obtaining a semiconductor device 1 in which a semiconductor chip 21 formed with a plurality of solder bumps 22 having a melting point of 200°C or higher is thermocompression bonded onto a substrate 31 fed with a liquid resin composition after the formation of a wiring 32 to obtain the semiconductor device 1 in which the wiring 32 and the solder bumps 22 are connected, and sealed with the cured liquid resin composition 41. The composition comprises: (A) a liquid naphthalene type epoxy resin -containing liquid epoxy resin; (B) isophthalic dihydrazide; (C) silica powder with the average grain size of 1 μm or lower; and (D) a potential curing promoter, and the hydrazide equivalent of the (B) component, the content of the (C) component and the content of the (D) component lie within specified ranges. |
