发明名称 |
DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES, FOR SEMICONDUCTOR TEST USING A PACKAGE, AND ASSOCIATED SYSTEMS AND METHODS |
摘要 |
Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package. |
申请公布号 |
WO2014105899(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
WO2013US77684 |
申请日期 |
2013.12.24 |
申请人 |
ADVANCED INQUIRY SYSTEMS, INC. |
发明人 |
PRESTON, DOUGLAS A.;JOHNSON, MORGAN T. |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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