发明名称 ETCHANT AND ETCHING PROCESS FOR OXIDES CONTAINING AT LEAST INDIUM AND GALLIUM
摘要 The present invention relates to an etchant and an etching process, which are preferred for use in etching of oxides containing at least indium and gallium, such as an oxide consisting of indium, gallium and oxygen or an oxide consisting of indium, gallium, zinc and oxygen. According to preferred embodiments of the present invention, an etchant comprising sulfuric acid or a salt thereof and a carboxylic acid (except for oxalic acid) or a salt thereof ensures a preferred etching rate, a good residue removal property and low corrosiveness to wiring materials when used in etching of oxides containing at least indium and gallium. Moreover, this etchant not only causes no precipitate but also retains a preferred etching rate even when the concentration of oxides dissolved in the etchant is elevated.
申请公布号 US2014186996(A1) 申请公布日期 2014.07.03
申请号 US201314083940 申请日期 2013.11.19
申请人 Mitsubishi Gas Chemical Company, Inc. 发明人 TAKEUCHI Hidenori;YUBE Kunio;OKABE Satoshi;USUI Mari
分类号 C09K13/06;H01L21/465 主分类号 C09K13/06
代理机构 代理人
主权项 1. An etchant for etching an oxide containing at least indium and gallium, which comprises sulfuric acid or a salt thereof and a carboxylic acid (except for oxalic acid) or a salt thereof.
地址 Chiyoda-ku JP