发明名称 WIRING SUBSTRATE
摘要 <p>A wiring board includes a substrate layer made of an insulative material, an insulating layer laminated on the substrate layer and a connection terminal made of a conductive material. The insulating layer has a first surface formed with an opening, a second surface located inside the opening and recessed toward the substrate layer with respect to the first surface and a wall surface located inside the opening and extending between the first and second surfaces in a lamination direction of the insulating layer relative to the substrate layer. The connection terminal is exposed from the second surface. The second surface extends between the wall surface and the connection terminal and has a curved shape being convex toward the substrate layer and including a deepest part closest to the substrate layer so as to satisfy relationship of L1 > L2 where L1 is a length between the wall surface and the deepest part in a layer in-plane direction perpendicular to the lamination direction; and L2 is a length between the deepest part and the connection terminal in the layer in-plane direction.</p>
申请公布号 EP2750172(A1) 申请公布日期 2014.07.02
申请号 EP20130831747 申请日期 2013.08.05
申请人 NGK SPARK PLUG CO., LTD. 发明人 NISHIDA, TOMOHIRO;MORI, SEIJI;WAKAZONO, MAKOTO
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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