Thin substrate PoP structure

摘要

A PoP (package-on-package) package includes a bottom package with a substrate encapsulated in an encapsulant with a die coupled to the top of the substrate. At least a portion of the die is exposed above the encapsulant on the bottom package substrate. A top package includes a substrate with encapsulant on both the frontside and the backside of the substrate. The backside of the top package substrate is coupled to the topside of the bottom package substrate with at least part of the die being located in a recess in the encapsulant on the backside of the top package substrate.

主权项

1. A semiconductor device package assembly, comprising:
a first substrate with a first encapsulant at least partially covering a top of the first substrate; a die coupled to the top of the first substrate, wherein the die is at least partially encapsulated in the first encapsulant; and a second substrate with a second encapsulant at least partially covering a bottom of the second substrate; wherein the bottom of the second substrate is coupled to the top of the first substrate; and wherein at least part of the die is located in a recess in the second encapsulant.