CHIP-EMBEDDED PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND MANUFACTURING METHOD OF CHIP-EMBEDDED PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a chip-embedded printed circuit board (PCB), a semiconductor package using the PCB, and a manufacturing method of the chip-embedded PCB.SOLUTION: The semiconductor package using a chip-embedded PCB includes upper and lower semiconductor packages having a PoP structure. The lower semiconductor package includes a base substrate including predetermined circuit patterns formed therein; an electronic component electrically connected to the circuit patterns and embedded in the base substrate such that one surface thereof is exposed to an upper surface of the base substrate; and a heat dissipation member installed on an exposed surface of the electronic component to dissipate heat generated from the electronic component to the outside. Thus, a semiconductor package product which improves a heat dissipation function can be manufactured, thereby improving reliability with respect to the product.