| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving connection reliability of a junction part between a conductor and a surface electrode of a semiconductor element.SOLUTION: A semiconductor device 1 of the present embodiment comprises: semiconductor elements 2, 3; a first conductor 8 having through holes 9, 11 arranged opposite to and substantially parallel with surface electrodes (an emitter electrode 2e, an anode electrode 3a) of the semiconductor elements 2, 3; and conductive junction materials 10, 12 for connecting sidewalls of the through holes 9, 11 and the surface electrodes (the emitter electrode 2e, the anode electrode 3a). The first conductor 8 has a surface treatment layer 8s on a surface on the side opposite to the surface electrodes (the emitter electrode 2e, the anode electrode 3a), for blocking wetting of the conductive junction materials 10, 12. |
