| 发明名称 |
METHOD FOR MANUFCTURING LIGHT EMITTING DIODE PACKAGE |
| 摘要 |
A method for manufacturing an LED package comprising following steps: providing a substrate and an LED chip mounted on the substrate; providing glue and arranging the glue on a periphery of the substrate and drying the glue to form a blocking loop to enclose the LED chip therein; and injecting the glue in the blocking loop, and drying the glue to form a packaging layer to encapsulate the LED chip therein. Light emitted from the LED chip travels through a top surface of the packaging layer, a periphery of the packaging layer, and the blocking loop to illuminate. |
| 申请公布号 |
US2014179038(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
US201313923292 |
申请日期 |
2013.06.20 |
| 申请人 |
Hon Hai Precision Industry Co., Ltd. |
发明人 |
LAI CHIH-CHEN |
| 分类号 |
H01L33/52 |
主分类号 |
H01L33/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing an LED package comprising following steps:
providing a substrate and an LED chip mounted on the substrate; providing a dispensing machine with a nozzle, and filling the dispensing machine with glue; squeezing the glue out of the dispensing machine from the nozzle, arranging the glue on a periphery of the substrate and drying the glue to form a blocking loop to enclose the LED chip therein; and injecting the glue in the blocking loop, and drying the glue to form a packaging layer to encapsulate the LED chip therein; wherein light emitted from the LED chip travels through a top surface of the packaging layer, a periphery of the packaging layer, and the blocking loop to illuminate. |
| 地址 |
New Taipei TW |
