| 发明名称 |
HEAT SINK FOR COOLING AN ELECTRIC COMPONENT |
| 摘要 |
The invention relates to a heat sink (400) for cooling an electric component, comprising a contact surface (404) which can be placed in heat-conductive contact with a mating contact surface of the electric component, said contact surface (404) comprising at least one elastically deformable section (406). |
| 申请公布号 |
WO2014095202(A1) |
申请公布日期 |
2014.06.26 |
| 申请号 |
WO2013EP74099 |
申请日期 |
2013.11.18 |
| 申请人 |
PHOENIX CONTACT GMBH & CO KG;APTRONIC AG |
发明人 |
HENKEL, HARTMUT;HEINEMANN, MICHAEL;REMMERT, GUIDO |
| 分类号 |
F16B2/24;F16B5/06;H05K1/02;H05K1/03;H05K5/00;H05K7/14;H05K7/20 |
主分类号 |
F16B2/24 |
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