| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition as the insulating adhesive component which is suitable for an anisotropic conductive adhesive that is less likely to be discolored by heat or light and in addition that exhibits practically sufficient die shear strength, during the manufacturing of light-emitting devices by flip chip packaging a light-emitting element such as a light-emitting diode (LED) or the like onto a wiring board using the anisotropic conductive adhesive.SOLUTION: The thermosetting resin composition contains an epoxy group-containing siloxane compound, more specifically tetrakis (diglycidyl isocyanuryl modified siloxy) silane, and a curing agent for epoxy resin. |
