A METHOD FOR RELEASING MEMS DEVICE

摘要

The present invention relates to a method for releasing a MEMS device which provides a complete dry release method to prevent stiction or adhesion problem during the MEMS device release process. Adopting an all-dry processing avoids the need to perform rinsing and drying process steps during fabrication. The release process is divided into two parts i.e. the backside release (200) and the front side release process (300).