发明名称 LIGHT-EMITTING-DEVICE PACKAGE AND A METHOD FOR PRODUCING THE SAME
摘要 A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.
申请公布号 EP2383807(A4) 申请公布日期 2014.06.18
申请号 EP20090836403 申请日期 2009.12.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JIN-HA;NEI, MASAMI;HWANG, SEOK-MIN;JEON, CHUNG-BAE
分类号 H01L33/52;H01L33/60 主分类号 H01L33/52
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