| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor module which has high durability to a thermal cycle. <P>SOLUTION: The semiconductor module is provided with: a semiconductor element 10 ;and a solder junction portion 12 for connecting a wiring portion 16 and at least a part of an insulating substrate 18. The solder junction portion 12 has a junction present on a surface of a removal region where a part of the wiring portion 16 is removed, and has no junction on a side surface of a step connecting with the removal region. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
