发明名称 Temperature hardened pharmaceutical devices
摘要 A system and method for implementing embedded electronics in environments where radiation or extreme temperatures are used is disclosed. Embedded electronics are affixed to various components of a pharmaceutical system, thereby enabling the customer to download pertinent information about the component, such as lot number, date of manufacturer, test parameters, etc. Additionally, these electronics allow an array of functions and features to be implemented, such as integrity tests and diagnostics. The electronics in the pharmaceutical components utilize a technology that is not as susceptible to radiation and extreme temperatures as traditional electronics.
申请公布号 US8753569(B2) 申请公布日期 2014.06.17
申请号 US200912502259 申请日期 2009.07.14
申请人 EMD Millipore Corporation 发明人 Burke Aaron
分类号 A61L2/00;A61L2/18 主分类号 A61L2/00
代理机构 Nields, Lemack & Frame, LLC 代理人 Nields, Lemack & Frame, LLC
主权项 1. A method of creating a sterile component for pharmaceutical or medical use having embedded electronics, comprising: manufacturing an electronic device using Silicon on Insulator (SOI) technology; affixing said electronic device to said component; and sterilizing said component by subjecting said component to high temperature steam sterilization, wherein said electronic device is a sensor, comprising a sensor head adapted to convert a physical characteristic to an electric signal and a sensor body, wherein said sensor is selected from the group consisting of fluid condition sensors, including pressure sensors, temperature sensors, and flow rate sensors, and fluid component sensors, including chemical sensors and concentration sensors, and wherein said sensor comprises a storage device proximate said sensor head and configured to store calibration data associated with said sensor head, whereby said sensor head and said storage device are manufactured using SOI technology.
地址 Billerica MA US