| 发明名称 |
POLISHING SYSTEM AND POLISHING METHOD |
| 摘要 |
A polishing system for polishing a semiconductor wafer includes a wafer supporting unit for holding the semiconductor wafer, and a first polishing pad for polishing the region of the semiconductor wafer. The semiconductor wafer has a first diameter. The first polishing pad has a second diameter which is shorter than the first diameter. |
| 申请公布号 |
KR20140073382(A) |
申请公布日期 |
2014.06.16 |
| 申请号 |
KR20130023785 |
申请日期 |
2013.03.06 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIN SHIH CHI;WU KUN TAI;CHOU YOU HUA;LEE CHIH TSUNG;HONG MIN HAO;WU CHIH JEN;HUANG CHEN MING;HUANG SOON KANG;CHAN CHIN HSIANG;YANG CHIH YUAN |
| 分类号 |
H01L21/304;B24B37/04 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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