| 发明名称 |
Semiconductor device having chip mounted on an interposer |
| 摘要 |
A semiconductor device 100 includes: a first semiconductor package 10; a first interposer 12 having an upper surface on which the first semiconductor package 10 is mounted; a first molding resin 14 that is provided on the upper surface of the first interposer 12 and seals the first semiconductor package 10; a second semiconductor package 20 mounted on an upper surface of the first molding resin 14; a second interposer 22 on which the second semiconductor package 20 is mounted by flip chip bonding; and a second molding resin 40 that is provided on the upper surface of the first interposer 12 and seals the first molding resin 14, the second semiconductor package 20, and the second interposer 22. The second semiconductor package 20 is mounted, with a surface thereof opposite to another surface mounted on the second interposer 22 faced down, on the upper surface of the first molding resin 14 via an adhesive 30. |
| 申请公布号 |
US8749039(B2) |
申请公布日期 |
2014.06.10 |
| 申请号 |
US20080196156 |
申请日期 |
2008.08.21 |
| 申请人 |
Spansion LLC |
发明人 |
Onodera Masanori |
| 分类号 |
H01L23/02;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
1. A semiconductor device comprising:
a first semiconductor chip; a first interposer having an upper surface on which the first semiconductor chip is mounted; a first molding resin, provided on the upper surface of the first interposer, which surrounds and seals the first semiconductor chip including the uppermost surface of the first semiconductor chip; a support member having a surface that contacts the upper surface of the first molding resin that is of equal length to that of the upper surface of the first molding resin; a second semiconductor chip mounted above the first molding resin; a second interposer on which the second semiconductor chip is mounted by flip chip bonding; and a second molding resin, provided on the upper surface of the first interposer, which surrounds and seals the first molding resin, the second semiconductor chip, and the second interposer; wherein the second semiconductor chip is mounted, with a surface thereof opposite to another surface mounted on the second interposer faced down, on the upper surface of the first molding resin via the support member.
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| 地址 |
Sunnyvale CA US |
