发明名称 HALF AROMATIC POLYAMIDE RESIN COMPOSITION AND COMPACT OBTAINED BY MOLDING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a polyamide resin composition excellent in heat resistance, mechanical strength, magnetic properties and molding fluidity.SOLUTION: A half aromatic polyamide resin composition contains 100 pts.mass of half aromatic polyamide (A) and 50 to 2000 pts.mass of a magnetic powder (B), the half aromatic polyamide (A) contains an aromatic dicarboxylic acid component, an aliphatic diamine component and a monocarboxylic acid component, has a melting point of 300°C or higher and contains terephthalic acid as the aromatic dicarboxylic acid component and a monocarboxylic acid having a molecular weight of 140 or more as the monocarboxylic acid component, and the content of the monocarboxylic acid having the molecular weight of 140 or more is 1 to 8 mass%.</p>
申请公布号 JP2014101494(A) 申请公布日期 2014.06.05
申请号 JP20130210631 申请日期 2013.10.08
申请人 UNITIKA LTD 发明人 KABASHIMA YOHEI
分类号 C08L77/06;C08G69/26 主分类号 C08L77/06
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