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1. A method of fabricating an electronic device, comprising:
fabricating an integrated circuit, the fabricating including:
forming scribe lines in a semiconductor wafer,embedding a circuit region in a substrate of the wafer,making, on a front side of the wafer, a ground contact pad of the integrated circuit that is electrically linked to the circuit region and to the substrate, wherein the ground contact pad of the integrated circuit is made in one of the scribe lines of the wafer, andindividualizing the integrated circuit by singulating the wafer in the scribe lines and destroying the ground contact pad; and assembling the integrated circuit in a package that includes a ground plane and interconnection leads, the assembling including electrically contacting a back side of the integrated circuit with a ground interconnection lead of the package and thereby replacing the ground contact pad destroyed during individualizing the integrated circuit.
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