发明名称 Light-emitting-element mounting package, light emitting device, backlight, and liquid crystal display device
摘要 A small and thin, light-emitting-element mounting package is provided, in which light emitting elements may by independently controlled despite a side view type package, and a light emitting device using the package is provided. The light-emitting-element mounting package includes a lead frame. The lead frame has at least one set of a structure including a lower conductor layer, an insulating layer and an upper conductor layer in this order, and a mounting area exposed on a surface of the lower conductor layer.
申请公布号 US8740409(B2) 申请公布日期 2014.06.03
申请号 US20100710689 申请日期 2010.02.23
申请人 Sony Corporation 发明人 Nakata Hidehiko;Kawasumi Takayuki;Memezawa Akihiko
分类号 F21S8/02 主分类号 F21S8/02
代理机构 代理人
主权项 1. A light-emitting-element mounting package comprising: a plurality of lead frames arranged horizontally side by side, the plurality of lead frames extending into a cavity of a mold portion that contains a phosphor-mixed resin or a transparent resin, each of the lead frames including at least one set of a structure including a lower conductor layer, an insulating layer and an upper conductor layer stacked in a direction of stacking in this order, the lower conductor layer and the upper conductor layer in a first one of the lead frames forming two stacked terminals that are electrically independent of terminals formed by the lower conductor layer and the upper conductor layer in a second one of the lead frames, and the lower conductor layer and the upper conductor layer in each of the plurality of lead frames are configured to be electrically connected to a mounting board so that a side of the plurality of lead frames in the direction of stacking faces a mounting surface of the mounting board that the light-emitting-element mounting package is configured to be mounted on, in at least one set, an inner end of the insulating layer and an inner end of the upper conductive layer is aligned at an edge and a portion of the lower conductor layer extends further inward from the edge, and in at least one set, a mounting area is exposed on a surface of the portion of the lower conductor layer that extends further inward from the edge.
地址 Tokyo JP