发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD FOR MANUFACTURING SOLID STATE IMAGE SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor epitaxial wafer capable of suppressing metal pollution by exerting higher gettering capability.SOLUTION: A method for manufacturing a semiconductor epitaxial wafer comprises: a first step for forming a modified layer 18 in which carbon and a dopant element as elements composing a cluster ion 16, are solidly solved therein, on a surface 10A of the semiconductor wafer, by irradiating the cluster ion 16 to the surface 10A of the semiconductor wafer 10; and a second step for forming an epitaxial layer 20 having a dopant element concentration being lower than a peak concentration of the dopant element in the modified layer 18, on the modified layer 18 of the semiconductor wafer.
申请公布号 JP2014099482(A) 申请公布日期 2014.05.29
申请号 JP20120249731 申请日期 2012.11.13
申请人 SUMCO CORP 发明人 KADONO TAKESHI;KURITA KAZUNARI
分类号 H01L21/322;H01L21/20;H01L27/146 主分类号 H01L21/322
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