发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD FOR MANUFACTURING SOLID STATE IMAGE SENSOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor epitaxial wafer capable of suppressing metal pollution by exerting higher gettering capability.SOLUTION: A method for manufacturing a semiconductor epitaxial wafer comprises: a first step for forming a modified layer 18 in which carbon and a dopant element as elements composing a cluster ion 16, are solidly solved therein, on a surface 10A of the semiconductor wafer, by irradiating the cluster ion 16 to the surface 10A of the semiconductor wafer 10; and a second step for forming an epitaxial layer 20 having a dopant element concentration being lower than a peak concentration of the dopant element in the modified layer 18, on the modified layer 18 of the semiconductor wafer. |
申请公布号 |
JP2014099482(A) |
申请公布日期 |
2014.05.29 |
申请号 |
JP20120249731 |
申请日期 |
2012.11.13 |
申请人 |
SUMCO CORP |
发明人 |
KADONO TAKESHI;KURITA KAZUNARI |
分类号 |
H01L21/322;H01L21/20;H01L27/146 |
主分类号 |
H01L21/322 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|