| 摘要 |
Provided is a polishing composition which has good storage stability and can polish an object having poor chemical reactivity at a high speed. The present invention is a polishing composition which comprises a silica having an organic acid immobilized on the surface thereof, a dihydric alcohol having a molecular weight of less than 20,000 and a pH-adjusting agent, and which has a pH value of 6 or less. |
