发明名称 EPOXY RESIN/INORGANIC MATTER COMPOSITE SHEET FOR SEALING
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin/inorganic matter composite sheet for sealing that has good workability, achieves the reduction in both a coefficient of linear expansion and a flexural modulus after cured to inhibit warpage, has excellent laser processability and has high sealing reliability.SOLUTION: The epoxy resin/inorganic matter composite sheet for sealing is formed in a semi-cured state by applying an epoxy resin composition comprising as essential components an epoxy resin, a curing agent and an inorganic filler to a surface of a carrier material and heating/drying the composition. A cured product of the epoxy resin/inorganic matter composite sheet for sealing has a glass transition temperature of less than 50°C and has a coefficient of linear expansion at a temperature lower than the glass transition temperature of not less than 5 ppm/°C to less than 20 ppm/°C.
申请公布号 JP2014095063(A) 申请公布日期 2014.05.22
申请号 JP20130047885 申请日期 2013.03.11
申请人 PANASONIC CORP 发明人 YAMAMOTO TAKAYUKI
分类号 C08G59/22;C08K3/36;C08L33/08;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/22
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