SEMICONDUCTOR DEVICE AND TESTING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To shorten time required for testing a semiconductor device comprised of a multi-chip package, or a plurality of core chips and an interface chip.SOLUTION: A semiconductor device comprises: a plurality of layered core chips CC0-CC7 each of the core chips having a memory cell array; and a plurality of current paths C0-C7 provided through a plurality of memory chips. Each core chip comprises a test circuit 67 for reading test data from a corresponding memory cell array and outputs a layer test result signal corresponding to the test data to each of the current paths C0-C7 different for each memory chip.