发明名称 HEATING PACK SYSTEM
摘要 The present invention relates to a heating pack system and, more specifically, to a heating pack system which uses a phase change material (PCM) having heat absorption properties during a phase change from solid state to liquid state. The heating pack system: can increase heat release time; can improve adhesion to a user; can reduce an area which does not release heat when the heating pack is erected; can heat a plurality of heating packs by using one power supply source; can easily increase a number of usable heating packs; and can select a heating temperature of the heating pack by increasing or decreasing the number of heating packs.
申请公布号 KR101398201(B1) 申请公布日期 2014.05.22
申请号 KR20130005722 申请日期 2013.01.18
申请人 JI, DUCK SUN;LEE, JEONG KUN;EST CO., LTD. 发明人 JI, DUCK SUN;LEE, JEONG KUN
分类号 H05B1/00;H05B3/14;H05B3/20 主分类号 H05B1/00
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