| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING THE SAME |
| 摘要 |
<p>The present invention relates to a printed circuit board and a method of manufacturing the same. The printed circuit board and the method of manufacturing the same according to one embodiment of the present invention include a base substrate in which a connection pad is formed; a dam which is separated from one side of the connection pad; and a protective layer which surrounds the dam. According to one embodiment of the present invention, the protective layer is made of liquefied polyethylene terephthalate (PET).</p> |
| 申请公布号 |
KR20140060116(A) |
申请公布日期 |
2014.05.19 |
| 申请号 |
KR20120126812 |
申请日期 |
2012.11.09 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO, HYE JIN;LEE, SE KYUNG;SON, BAE SOON;HAM, SUK JIN |
| 分类号 |
H01L21/60;H01L23/12;H05K3/34 |
主分类号 |
H01L21/60 |
| 代理机构 |
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