| 摘要 |
The present invention relates to a method for manufacturing a multilayer flexible printed circuit board and, more particularly, to a method for manufacturing a multilayer flexible printed circuit board which includes the steps of: preparing an internal layer substrate member; forming a plurality of first via holes; forming a first copper plating layer and a plurality of first blind vias by plating the surface of the internal layer substrate member on which the first via holes are formed with copper; forming a circuit pattern by partially removing a copper foil layer and the first copper plating layer formed on the surface of the internal layer substrate member; forming a plurality of second via holes; forming a second copper plating layer and a plurality of blind vias by plating the surface of an external layer substrate member on which the second via holes are formed with the copper; and completely forming the flexible printed circuit board. |
