发明名称 Apparatus and method for treating substrate
摘要 PURPOSE: A substrate processing apparatus and method are provided to minimize the exhaust pressure difference between each exhaust hole by controlling the aperture ratio of the exhaust holes to be equal. CONSTITUTION: A substrate support member supports a substrate in a chamber. A gas supply member supplies a process gas from inside the chamber to the substrate. An exhaust member(300) discharges the process gas from the chamber to the outside. The exhaust member includes an exhaust ring(310) and a blocking plate(315). The exhaust ring includes a plurality of exhaust holes. The blocking plate controls the aperture ratio of the exhaust hole. Air is exhausted from the chamber through each exhaust hole.
申请公布号 KR101395240(B1) 申请公布日期 2014.05.15
申请号 KR20100140010 申请日期 2010.12.31
申请人 发明人
分类号 H01L21/205 主分类号 H01L21/205
代理机构 代理人
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