| 摘要 |
In a method of soldering on brazing nickel or nickel base alloys the boron and fluorine containing type flux has copper or a copper compound (oxide or chloride) added. The stated range is 0.1-3% which is sufficient to deposit a layer of copper but not to interfere with the characteristics of the flux. This addition prevents the occurrence of cracking due to grain boundary embrittlement which occurs with prior art fluxes. The Provisional Specification discloses the use of Sn, Au, Ag, Pd, p Pt, or any other metal above nickel in the electrochemical series, as an alternative or in addition to copper. This matter does not appear in the Specification as accepted.
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