| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer shape measurement device that makes grinding striations of a notch part of a wafer visually recognizable.SOLUTION: A shape measurement device 70 is configured to: irradiate a notch part N of a wafer W with light from an LED illumination device 74 from a direction parallel with respect to a principal surface PS of the wafer W; photograph the notch part N of the wafer W illuminated by the light and the principal surface PS from a direction orthogonal with respect to the principal surface PS of the wafer W by an upper surface CCD camera 76 and a bottom surface CCD camera 78; extract an image of a bright part out of images having a bright part and a dark part photographed by the upper surface CCD camera 76 and the bottom surface CCD camera 78 as an image of the notch part N; and acquire a shape of the notch part N. Further, a light shield plate is provided that shields, out of light incident to any point of a straight line part of the notch part N from the LED illumination device 74, light incident to a side of a circular-arch part with respect to any point thereof and having an incident angle of 5 degrees or more.</p> |
