发明名称 CLEANER DEVICE, AND MOLD APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a cleaner device in which a resin deposited to a molding die or a plunger can be effectively removed.SOLUTION: There is provided a cleaner device 10 in which a resin deposited to a molding die 60 or a plunger can be removed. The cleaner device 10 includes: a rotation member 16 that moves on a molding die 60 or a plunger while rotating around a prescribed rotation axis; a rubber element 12 that moves while contacting to the molding die or the plunger; and a suction means 20 that sucks a resin removed by the rotation member 16 or the rubber element 12.
申请公布号 JP2014083784(A) 申请公布日期 2014.05.12
申请号 JP20120235214 申请日期 2012.10.25
申请人 APIC YAMADA CORP 发明人 SAITO TAKASHI
分类号 B29C33/72;B08B5/04;B29C45/02;B29C45/17 主分类号 B29C33/72
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