发明名称 |
CLEANER DEVICE, AND MOLD APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a cleaner device in which a resin deposited to a molding die or a plunger can be effectively removed.SOLUTION: There is provided a cleaner device 10 in which a resin deposited to a molding die 60 or a plunger can be removed. The cleaner device 10 includes: a rotation member 16 that moves on a molding die 60 or a plunger while rotating around a prescribed rotation axis; a rubber element 12 that moves while contacting to the molding die or the plunger; and a suction means 20 that sucks a resin removed by the rotation member 16 or the rubber element 12. |
申请公布号 |
JP2014083784(A) |
申请公布日期 |
2014.05.12 |
申请号 |
JP20120235214 |
申请日期 |
2012.10.25 |
申请人 |
APIC YAMADA CORP |
发明人 |
SAITO TAKASHI |
分类号 |
B29C33/72;B08B5/04;B29C45/02;B29C45/17 |
主分类号 |
B29C33/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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