<p>Embodiments include curable compositions including an epoxy resin and a hardener component including a terpolymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.</p>
申请公布号
EP2726548(A1)
申请公布日期
2014.05.07
申请号
EP20110868715
申请日期
2011.06.30
申请人
DOW GLOBAL TECHNOLOGIES LLC
发明人
XIONG, JIAWEN;CHEN, HONGYU;MULLINS, MICHAEL J.;ZHANG, CHAO;LIAO, ANNIE GUIHONG;ZHANG, WAYNE YI