发明名称 MEMS device with release aperture
摘要 The present disclosure provides a method of fabricating a micro-electro-mechanical systems (MEMS) device. In an embodiment, a method includes providing a substrate including a first sacrificial layer, forming a micro-electro-mechanical systems (MEMS) structure above the first sacrificial layer, and forming a release aperture at substantially a same level above the first sacrificial layer as the MEMS structure. The method further includes forming a second sacrificial layer above the MEMS structure and within the release aperture, and forming a first cap over the second sacrificial layer and the MEMS structure, wherein a leg of the first cap is disposed between the MEMS structure and the release aperture. The method further includes removing the first sacrificial layer, removing the second sacrificial layer through the release aperture, and plugging the release aperture. A MEMS device formed by such a method is also provided.
申请公布号 US8716051(B2) 申请公布日期 2014.05.06
申请号 US20100908985 申请日期 2010.10.21
申请人 LIN CHUNG-HSIEN;CHU CHIA-HUA;CHENG CHUN-WEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN CHUNG-HSIEN;CHU CHIA-HUA;CHENG CHUN-WEN
分类号 H01L21/00 主分类号 H01L21/00
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