发明名称 Printed circuit board
摘要 A printed circuit board includes a core substrate having an opening portion, an electronic component provided in the opening portion of the core substrate and including a dielectric body, a first electrode formed over the dielectric body, and a second electrode formed over the dielectric body such that the dielectric body is interposed between the first electrode and the second electrode, and a resin filling a gap between the core substrate and the electronic component in the opening portion of the core substrate. The resin filling the gap includes a filler.
申请公布号 US8717772(B2) 申请公布日期 2014.05.06
申请号 US20090566776 申请日期 2009.09.25
申请人 INAGAKI YASUSHI;ASAI MOTOO;WANG DONGDONG;YABASHI HIDEO;SHIRAI SEIJI;IBIDEN CO., LTD. 发明人 INAGAKI YASUSHI;ASAI MOTOO;WANG DONGDONG;YABASHI HIDEO;SHIRAI SEIJI
分类号 H05K1/18;H01L21/48;H01L23/498;H01L23/50;H01L23/64;H01L25/16;H05K1/02;H05K3/46 主分类号 H05K1/18
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