发明名称 |
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME |
摘要 |
A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body. |
申请公布号 |
US2014117553(A1) |
申请公布日期 |
2014.05.01 |
申请号 |
US201313968409 |
申请日期 |
2013.08.15 |
申请人 |
ZHEN DING TECHNOLOGY CO., LTD. |
发明人 |
HA WOO YONG;CHOU E-TUNG;LO WEN-LUN |
分类号 |
H01L21/768;H01L23/522 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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