| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photocurable resin composition having good workability, no generation of handling cracks, having high sensitivity, and giving high reliability of a cured product of the composition, for example, when used for a printed wiring board or a semiconductor package, and to provide a dry film and a cured product of the composition, and a printed wiring board using the film or the cured product.SOLUTION: The photocurable resin composition is developable with an alkali solution and comprises a carboxyl group-containing photosensitive resin, a photopolymerization initiator, a filler and an elastomer, in which the content of the filler is 40 vol.% or less in the whole non-volatile component of the composition. A cured product obtained by curing the composition with light shows a coefficient of linear expansion of 35 ppm or less and a glass transition temperature of 115°C or higher.</p> |
