| 摘要 |
A semiconductor device is provided that includes a substrate including a device region and a peripheral region surrounding the device region, a first interconnection including one or more first conductive lines extending in a first direction, a second interconnection including one or more second conductive lines extending in the first direction, the second interconnection spaced apart from the first interconnection, a first conductive plate and a second conductive plate spaced apart from each other, the first conductive plate corresponding to the first interconnection and the second conductive plate corresponding to the second interconnection, one or more first vias connecting the first conductive lines to the first conductive plate and overlapping the device region and one or more second vias connecting the second conductive lines to the second conductive plate, the second vias overlapping the device region and arranged in a staggered, alternating configuration with the one or more first vias. |
