发明名称 System and method for removing oxide from a sensor clip assembly
摘要 According to embodiments of the present disclosure, a method for removing oxide includes placing a sensor chip assembly having an oxide layer formed on a portion thereof within an enclosed and controlled environment. The portion of the sensor chip assembly is exposed to a reactive gas and a UV light to result in a substantial removal of the oxide layer formed on the portion of the sensor chip assembly.
申请公布号 US8709949(B2) 申请公布日期 2014.04.29
申请号 US201113107195 申请日期 2011.05.13
申请人 HAMPP ANDREAS;HARRIS SEAN F.;SADIGHI TALIEH H.;HANYALOGLU BENGI F.;RAYTHEON COMPANY 发明人 HAMPP ANDREAS;HARRIS SEAN F.;SADIGHI TALIEH H.;HANYALOGLU BENGI F.
分类号 H01L21/302 主分类号 H01L21/302
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