发明名称 |
System and method for removing oxide from a sensor clip assembly |
摘要 |
According to embodiments of the present disclosure, a method for removing oxide includes placing a sensor chip assembly having an oxide layer formed on a portion thereof within an enclosed and controlled environment. The portion of the sensor chip assembly is exposed to a reactive gas and a UV light to result in a substantial removal of the oxide layer formed on the portion of the sensor chip assembly. |
申请公布号 |
US8709949(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US201113107195 |
申请日期 |
2011.05.13 |
申请人 |
HAMPP ANDREAS;HARRIS SEAN F.;SADIGHI TALIEH H.;HANYALOGLU BENGI F.;RAYTHEON COMPANY |
发明人 |
HAMPP ANDREAS;HARRIS SEAN F.;SADIGHI TALIEH H.;HANYALOGLU BENGI F. |
分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|