| 摘要 |
The present invention provides a method for manufacturing an LED chip, which comprises the steps of irradiating a laser beam L on a motherboard (1) along a predetermined dividing line so as to form a segmentation starting point A for each LED element body (2), wherein the front surface (1a) of the translucent substrate (1) is formed with a plurality of LED element bodies (2) arranged in a pattern and the back surface (1b) of the translucent substrate (1) is formed with a reflection film (3). |
