| 摘要 |
The present invention relates to a thermosetting resin composition suitable for the manufacture of a reflector for a surface mounted type photosemiconductor device and, more specifically, to a thermosetting resin composition comprising an epoxy resin, a curing agent, an inorganic filler, a white pigment, and tetraphenyl phosphonium halide or alkyltriphenyl phosphonium halide as a curing catalyst. The thermosetting resin composition according to the present invention facilitates process simplification and productivity improvement since a prepolymer preparation process is not required. The reflector prepared by using the thermosetting resin composition exhibits excellent optical characteristic (reflectivity) maintenance performance in a high temperature condition, alleviates degradation phenomenon due to heat generated when a photosemiconductor device is operated, minimizes the reduction of reflexibility, and increases the production efficiency of a photosemiconductor device by performing transfer molding in an identical mode with a general surface mounted type semiconductor production mode. |
