| 摘要 |
PROBLEM TO BE SOLVED: To allow a product such as a thin substrate to withstand processing and handling and allow work to be easily performed, in an existing etching process. SOLUTION: Enclosed is an etching method which is characterized in that when the metal layer of a metal layer-fitted sheet with a metal layer formed on the surface is etched with an etching liquid by a wet process, etching is applied in a state where the metal layer-fitted sheet is supported between confronted two protective sheets provided with a plurality of micro pores passing through both surfaces, wherein one surface is confronted with either protective layer and the other surface is confronted with the other protective sheet. COPYRIGHT: (C)2009,JPO&INPIT |
